THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
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United States of America Patent
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Issued Date -
Sep 24, 2009
app pub date -
Aug 8, 2007
filing date -
Aug 8, 2006
priority date (Note) -
Abandoned
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Abstract
To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.
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