METHOD OF STACKING DIES FOR DIE STACK PACKAGE
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United States of America Patent
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Issued Date -
Sep 24, 2009
app pub date -
Nov 4, 2008
filing date -
Mar 18, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a die stack package includes the steps of providing a wafer having a first surface and a second surface, said first surface having a plurality of cut ways thereon, the second surface being coated with adhesive of a predetermined thickness at a predetermined position thereof, removing parts of the adhesive by photo-lithography, each of the parts of the adhesive corresponds to the cut way and is wider than the cut way; cutting the wafer along the cut ways to make a plurality of dies, each of the dies having a part of the adhesive thereon; and stacking each of the dies, whose surface having the adhesive faces a lower-layer die, on the lower-layer die. Therefore, the method facilitates the stacking operation and saves the production cost.
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