APPARATUS FOR TRANSFERRING PACKAGED CHIPS, TEST HANDLER AND METHOD FOR MANUFACTURING PACKAGED CHIPS
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United States of America Patent
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Issued Date -
Sep 24, 2009
app pub date -
Dec 19, 2008
filing date -
Mar 24, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An apparatus for transferring packaged chips, a test handler, and a method for manufacturing packaged chips are provided. The apparatus for transferring packaged chips may include a main frame having a coupling member coupled to a base plate and a supporting member coupled to the coupling member, a plurality of first pickers coupled to one side of the supporting member so as to be movable in a horizontal direction, a plurality of second pickers coupled to the other side of the supporting member so as to be movable in the horizontal direction, and a control unit to determine distances by which the first pickers and the second pickers move in the horizontal direction.
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