Window ball grid array package
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United States of America Patent
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N/A
Issued Date -
Sep 24, 2009
app pub date -
Jun 6, 2008
filing date -
Mar 19, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A WBGA (window ball grid array) semiconductor package includes a substrate having a slot as a window for a chip. The slot has four straight sections and four rounded corners respectively interconnecting adjacent two straight sides. Each rounded corner has a radius satisfying the minimum distance between the pads and the slot according to the design rule so as to increase the pad pitch in the chip. The plain area increased due to the pad pitch is suitable for ESD circuit or capacitors layout.
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