RADIATION-CURING RESIN COMPOSITION AND PREPREG
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United States of America Patent
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Issued Date -
Sep 17, 2009
app pub date -
Sep 6, 2006
filing date -
Sep 22, 2005
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Abandoned
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Abstract
A radiation-curing resin composition that includes a resin component that includes an epoxy resin and/or oxetane resin having a naphthalene structure or a biphenyl structure, a boron-based diaryliodonium salt polymerization initiator represented by a specific formula at 0.005 to 0.5 mol per kg of the resin component, and a viscosity adjusting agent, the resin composition having a viscosity at 50° C. of at least 50 Pa·s, and a prepreg obtained by impregnating a fiber reinforcement with such a resin composition. This resin composition has excellent reactivity, and a prepreg formed from this resin composition and a fiber reinforcement is used for producing a composite material/member suitable for the aerospace field in particular.
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