Semiconductor package structure with heat sink
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United States of America Patent
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N/A
Issued Date -
Sep 17, 2009
app pub date -
Apr 11, 2008
filing date -
Mar 11, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor package structure with a heat sink is disclosed herein. The semiconductor package structure includes a substrate having a chip mounting area and a plurality of through holes surrounding the chip mounting area; a chip set on the chip mounting area and electrically connected to the substrate; a heat sink covering the chip, wherein the heat sink has a plurality of support portions extending from the upper surface to the lower surface of the substrate via those through holes; and a molding compound covering the chip, a portion of the substrate and the heat sink. Those support portions of the heat sink are utilized to improve the heat dissipation efficiency and the warpage issue of the package.
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