PROBING APPARATUS FOR MEASURING ELECTRICAL PROPERTIES OF INTEGRATED CIRCUIT DEVICES ON SEMICONDUCTOR WAFER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 10, 2009
app pub date -
Mar 5, 2008
filing date -
Mar 5, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A probing apparatus comprises a wafer chuck configured to receive a semiconductor wafer having a plurality of integrated circuit devices and test keys configured to monitor the fabrication quality of the integrated circuit devices, a carrier configured to receive a probe card having a plurality of probe needles configured to contact the test keys of the semiconductor wafer and collect electrical information of the integrated circuit devices, and an angular adjusting module configured to adjust the angle between the probe card and the semiconductor wafer by rotating the semiconductor wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully