Use of Sub-Micron Copper Salt Particles in Wood Preservation

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United States of America Patent

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12349834

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Abstract

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of the particles in the slurry is less than about 1 micron; a dispersant; and water. The dispersant is anionic or a mix of anionic and non-ionic. Advantageously, less than 20% by weight of the particles have a diameter less than 20 nanometers. Useful copper salts include basic copper carbonate, tri-basic copper sulfate, copper oxychloride, basic copper nitrate, basic copper borate, copper borate, basic copper phosphate, or copper silicate. The slurry most preferably includes copper hydroxide particles. The slurry further advantageously includes at least one organic biocide, wherein at least a portion of the organic biocide is coated on the particles.

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OSMOSE INC980 ELLICOTT STREET BUFFALO NY 14209

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hodge, Robert L Sumter , US 25 479
Richardson, H Wayne Sumter , US 23 449

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