METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE
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United States of America Patent
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Issued Date -
Sep 3, 2009
app pub date -
Nov 7, 2008
filing date -
Feb 29, 2008
priority date (Note) -
Abandoned
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Abstract
In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed.
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