INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Aug 27, 2009
app pub date -
Feb 26, 2008
filing date -
Feb 26, 2008
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Abandoned
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Abstract
A semiconductor substrate for an integrated circuit device comprises at least one insulating substrate region being formed of a cohesive insulating material. The insulating substrate region includes at least two conductive vias extending at least between a first surface and a second surface of the insulating substrate region.
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