WAFER LEVEL PACKAGES FOR REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Aug 27, 2009
app pub date -
Feb 26, 2009
filing date -
Feb 26, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A solid state image sensor includes a microelectronic element having a front face and a rear face remote from the front face, the rear face having a recess extending towards the front surface. A plurality of light sensing elements may be disposed adjacent to the front face so as to receive light through the part of the rear face within the recess. A solid state image sensor can include a microelectronic element having a front face and a rear face remote from the front face, a plurality of light sensing elements disposed adjacent to the front face, the light sensing elements being arranged to receive light through the rear face. Electrically conductive package contacts may directly overlie the light sensing elements and the front face and be connected to chip contacts at the front face through openings in an insulating packaging layer overlying the front face.
First Claim
Other Claims data not available
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 123 Citation Count
- H01L Class
- 96.51 % this patent is cited more than
- 16 Age