Method for producing a micromechanical structural element and semiconductor arrangement
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United States of America Patent
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Issued Date -
Aug 27, 2009
app pub date -
May 19, 2006
filing date -
May 19, 2005
priority date (Note) -
Abandoned
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Abstract
The method serves for producing a micromechanical structure element (13) on or in a crystal substrate (3), wherein the micromechanical structure element (13) is arranged in vibratable fashion in a recess (4) of the crystal substrate (3) and is connected to the crystal substrate (3) by means of a web (15), comprising the following steps: providing the crystal substrate (3); depositing an etching mask layer (1); locally removing the etching mask layer (1), such that the remaining etching mask layer (1) has a border (8) extending at a predeterminable angle .phi. of less than 180.degree. on both sides of a connection region (19) of the web (15) to the crystal substrate (3), and etching the crystal substrate (3) in order to form the recess (4) and the micromechanical structure element (13). What is thereby achieved is that an uncovered crystal plane (7) runs through the connection region (19).
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