SINGLE-SIDED HIGH THROUGHPUT WET ETCHING AND WET PROCESSING APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
Aug 27, 2009
app pub date -
Feb 23, 2009
filing date -
Feb 22, 2008
priority date (Note) -
Abandoned
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Abstract
A processing system includes a plurality of chucks, each of the chucks configured to support a substrate such that a bottom surface of the substrate is exposed, a track configured to guide the plurality of chucks along a continuous path, and a processing arrangement configured to process the bottom surface of each substrate when the track guides the respective chuck over the processing arrangement, the processing arrangement including a fluid meniscus arranged to contact the bottom surface of each substrate when the track guides the respective chuck over the processing arrangement.
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