SPUTTERING TARGET
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United States of America Patent
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Issued Date -
Aug 27, 2009
app pub date -
Feb 24, 2009
filing date -
Feb 25, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a sputtering target in which an occurrence of target cracks can be inhibited. The sputtering target of the invention relates to a sputtering target produced by mixing and sintering a main powder containing In as a main component, which is obtained by pulverizing an ingot consisting of an intermetallic compound, and a sub-powder containing a different component composition from the above-mentioned main powder, wherein a total content of Si, Al and Fe which are unavoidable impurities is 300 ppm by mass or less. Further, the intermetallic compound contains In and at least one selected from Co and Ni.
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