Oriented Members for Thermally Conductive Interface Structures
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United States of America Patent
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Issued Date -
Aug 20, 2009
app pub date -
Feb 18, 2008
filing date -
Feb 18, 2008
priority date (Note) -
Abandoned
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Abstract
A thermally conductive interface structure for use in connection with heat-generating electronic components includes a polymer matrix material and one or more compressive members which are compressive under relatively light loads along a thickness direction of the interface structure. The compressive members are thermally conductive and define a plurality of reticulated apertures therein. The compressive members enable a relatively low compressive modulus along a thickness dimension of the thermally conductive interface structure.
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