METHOD FOR MANUFACTURING CERAMIC COVERING MEMBER FOR SEMICONDUCTOR PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Aug 20, 2009
app pub date -
Mar 16, 2007
filing date -
Mar 20, 2006
priority date (Note) -
Abandoned
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Abstract
Producing a ceramic coating member for a semiconductor processing apparatus with a purpose of improving the resistance of members and parts disposed inside of vessels such as semiconductor processing devices for conducting plasma etching treatment in a strong corrosive environment and as a means for solution, forming a porous layer by irradiating an oxide of an element in Group IIIa of the Periodic Table to be coated directly or through an undercoat on the surface of the substrate of a metal or non-metal and further forming a secondary recrystallized layer of the oxide on the porous layer through an irradiation treatment of a high energy such as electron beam and laser beam.
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