Method and Apparatus for Plasma Process Performance Matching in Multiple Wafer Chambers
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United States of America Patent
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Issued Date -
Aug 20, 2009
app pub date -
Feb 6, 2009
filing date -
Feb 14, 2008
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Abandoned
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Abstract
A multi-station workpiece processing system provides a targeted equal share of a regulated input process gas flow to each active processing station of a plurality of active processing stations using a single gas flow regulator for each gas and irrespective of the number of inactive processing stations.
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