SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESSION MOLDING
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United States of America Patent
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Issued Date -
Jul 30, 2009
app pub date -
Jan 28, 2009
filing date -
Jan 29, 2008
priority date (Note) -
Abandoned
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Abstract
By clamping upper and lower molds, a semiconductor chip and a stacking connection electrode are immersed in a resin material heated and molten in a cavity coated with a mold release film. The mold release film is pressed into contact with a tip portion of the connection electrode by a cavity bottom face member, so that a collective resin portion having a shape corresponding to the shape of the cavity is molded in the cavity. Accordingly, the semiconductor chip and the connection electrode are compression molded with the resin material. Here, a tip portion of the connection electrode is exposed from the collective resin portion.
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