Light emitting diode package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 30, 2009
app pub date -
Mar 27, 2008
filing date -
Jan 28, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other.
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