Vapor-Operated Soldering System and Vapor Generation System for a Soldering System
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United States of America Patent
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app pub date -
Apr 3, 2009
filing date -
Apr 22, 2004
priority date (Note) -
Abandoned
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Abstract
A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber.
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