Sputtering Targets and Methods for Depositing Film Containing Tin and Niobium
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United States of America Patent
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app pub date -
Apr 3, 2009
filing date -
Dec 14, 2005
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Abstract
Sputtering targets and sputtering methods for depositing a film that includes tin and niobium. Substrates bearing coatings comprising tin and niobium, for example, low-emissivity coatings including blocker films comprising tin and niobium, or solar control coatings (e.g., conductive oxide coatings) including tin and niobium methods of manufacturing sputtering targets comprising tin and niobium.
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