LIQUID DISTRIBUTION IN AN EVAPORATIVE HEAT REJECTION SYSTEM
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United States of America Patent
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Issued Date -
Jul 30, 2009
app pub date -
Jan 30, 2008
filing date -
Jan 30, 2008
priority date (Note) -
Abandoned
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Abstract
A liquid distribution system for an evaporative heat rejection system that includes a heat transfer surface is disclosed. The liquid distribution system includes a plurality of liquid conduits adapted to transport liquid for distribution over the heat transfer surface, and each liquid conduit having at least one orifice. At least a first orifice in a first conduit and a second orifice in a second conduit are positioned such that when the liquid is transported under a predetermined pressure thought the conduits, the liquid is emitted from the first and second orifices in first and second streams, respectively, that collide at a collision site, thus causing liquid to be scattered from the collision site and distributed over the heat transfer surface.
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