Sputter Target Having a Sputter Material Based on TiO2 and Production Method

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United States of America Patent

APP PUB NO 20090183987A1
SERIAL NO

12302302

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Abstract

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A sputter target is provided having a sputter material based on TiO.sub.2 and made such that the sputter material contains 15-60 mol. % Nb.sub.2O.sub.5. A method for the production of the sputter target includes the following steps: mixing of TiO.sub.2 and Nb.sub.2O.sub.5 powder in a liquid slurry; spray granulating this slurry to form TiO.sub.2:Nb.sub.2O.sub.5 mixed oxide granulate; and plasma spraying this granulate onto a sputter target base body.

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Patent Owner(s)

Patent OwnerAddress
HERAEUS MATERIALS TECHNOLOGY GMBH & CO KGHERAEUSSTRASSE 12-14 HANAU 63450

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Männle, Eckehard Flörsbachtal , DE 1 1
Simons, Christoph Biebergemünd , DE 17 62
Weigert, Martin Hanau , DE 49 589

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