COPPER-NICKEL-SILICON ALLOYS
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United States of America Patent
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Issued Date -
Jul 23, 2009
app pub date -
Dec 17, 2008
filing date -
Dec 21, 2007
priority date (Note) -
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Abstract
A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent Si, between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about 137 ksi, and an electrical conductivity of at least about 25% IACS.
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