Simple Efficient Assembly and Packaging of RF, FDD, TDD, HTS and/or Cryo-Cooled Electronic Devices
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United States of America Patent
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app pub date -
Feb 5, 2009
filing date -
Jul 21, 2006
priority date (Note) -
Abandoned
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Abstract
Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. These may include various ways of coupling, attaching, and/or connecting the various components to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place and provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filter(s) made of a high temperature superconductor material, low noise amplifier(s), switch(es), an isolator(s), and/or attenuator(s). A planar cable may be used for electrical connecting of components. These approaches may be used in, e.g., wireless communication systems and may be cryo-cooled.
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