METHOD FOR FORMING CIRCUIT IN MAKING PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jul 16, 2009
app pub date -
Aug 1, 2008
filing date -
Jan 16, 2008
priority date (Note) -
Abandoned
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Abstract
A method for forming circuit in making a printed circuit board includes the following steps. A patterned photoresist layer is formed on a surface of an insulating substrate such that a first portion of the surface of the insulating substrate is exposed and a second portion of the surface of the insulating substrate is covered by the patterned photoresist layer. An electrically conductive layer is deposited on the first portion of the surface of the insulating substrate so as to obtain a circuit formed on the surface of the insulating substrate. The patterned photoresist layer is removed from the surface second portion of the surface of the insulating substrate.
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