Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module
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United States of America Patent
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N/A
Issued Date -
Jul 9, 2009
app pub date -
Apr 2, 2007
filing date -
Apr 6, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The support is for fitting on a heat dissipation mass. The support comprises an electrically insulating plate and a heat conductor plate for conducting heat to the heat dissipation mass. In particular, the heat conductor plate is in contact with the electrically insulating plate. The heat conductor plate includes a layer forming a junction with the heat dissipation mass, referred to as its bottom layer, and a layer for stiffening the heat conductor plate, referred to as its intermediate layer. More particularly, the stiffener layer is made of a material of hardness greater than that of the material of the bottom layer.
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