SURFACE MOUNT CAPACITOR USED AS A SUBSTRATE FLIP-CHIP CARRIER IN A RADIO FREQUENCY IDENTIFICATION TAG
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United States of America Patent
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Issued Date -
Jul 9, 2009
app pub date -
Jan 9, 2009
filing date -
Jan 9, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a passive radio frequency identification (RFID) transponder comprising an integrated circuit, an antenna coil, and at least one surface mount capacitor, a configuration is disclosed in which the surface mount capacitor is used as the integrated circuit carrier. The integrated circuit comprises a bumped die flip-chip, and the surface mount capacitor substrate has electrically conductive contacts and connections for electrically joining the antenna coil, capacitor, and integrated circuit. Transponders in accordance with embodiments of the invention do not include an intermediate substrate carrier onto which the capacitor and integrated circuit are mounted and interconnected, and to which the antenna coil is subsequently attached.
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