PLATED PILLAR PACKAGE FORMATION
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United States of America Patent
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app pub date -
Mar 16, 2009
filing date -
Feb 16, 2007
priority date (Note) -
Abandoned
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Abstract
A device includes a first plurality of interconnects, a first fill material surrounding the first plurality of interconnects, a first plurality of traces, and a first chip. The first plurality of interconnects extend from a first side of the fill material to an opposite side of the fill material. Each of the traces is connected to at least two of the first plurality of interconnects. The first chip is coupled to at least one of the first plurality of traces.
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