IC MODULE, IC INLET, AND IC MOUNTED BODY
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United States of America Patent
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Issued Date -
Jul 9, 2009
app pub date -
Mar 26, 2007
filing date -
Mar 30, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An IC module including: an insulating substrate; antenna connection terminals provided on one surface of the insulating substrate; and a laminated body in which an IC chip and a mica capacitor are laminated, wherein the laminated body and the antenna connection terminals are mounted on the same surface side of the insulating substrate, and the IC chip and the mica capacitor are electrically connected with the antenna connection terminals via a wire, the IC module capable of producing an IC mounted body that has highly accurate resonance frequency and is highly reliable in non-contact communications, and also capable of producing an IC mounted body having a small area since the mounting thereof on a small area is possible, and which can be produced by a general purpose apparatus for producing IC modules, as well as an IC inlet and an IC mounted body using the IC module are provided.
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