Lead-free solder alloy and electoronic component using this lead-free solder alloy
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United States of America Patent
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app pub date -
Feb 17, 2009
filing date -
Feb 27, 2001
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Abandoned
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Abstract
Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented.Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400° C. to 480° C.
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