Polyimide film and methods relating thereto
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United States of America Patent
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Issued Date -
Jul 2, 2009
app pub date -
Jan 31, 2008
filing date -
Dec 21, 2007
priority date (Note) -
Abandoned
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Abstract
A polyimide film with advantageous handleability, flexibility, dimensional stability and heat resistance is provided. The polyimide film is characterized by block-copolymerizing an aromatic diamine component comprising 10˜25 mol % of paraphenylenediamine (a1) and 75˜90 mol % of 4,4′-diaminodiphenyl ether (a2) with an aromatic tetracarboxylic acid component consisting of 75˜99.9 mol % of pyromellitic acid dianhydride (b1) and 0.1˜25 mol % of 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride (b2). The Young's modulus, linear expansion coefficient, water absorption rate and glass transition temperature of such polyimide films can be controlled within very useful ranges.
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