METHOD AND APPARATUS FOR TREATING A SEMI-CONDUCTOR SUBSTRATE

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Mar 12, 2009
filing date
May 21, 1998

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Abandoned

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Abstract

This invention relates to a method of treating a semiconductor wafer and in particular, but not exclusively, to planarisation. The method consists of depositing a liquid short-chain polymer formed from a silicon containing bas or vapour. Subsequently water and OH are removed and the layer is stabilised.

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Patent Owner(s)

Patent Owner	Address
AVIZA TECHNOLOGY LIMITED	RINGLAND WAY NEWPORT SOUTH WALES NP18 2TA

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Beekman, Knut	Yatton , GB	9	168
Tucker, Guy Patric	Weston Super Mare , GB	1	0

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METHOD AND APPARATUS FOR TREATING A SEMI-CONDUCTOR SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12402720

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12402720

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