Method for producing semiconductor substrate and semiconductor substrate

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United States of America Patent

SERIAL NO

11658949

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Abstract

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layer prior to the SIMOX method processing is set to 0.05 (5%) or less.

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Patent Owner(s)

Patent OwnerAddress
KOMATSU DENSHI KINZOKU KABUSHIKI KAISHA25-1 SHINOMIYA 3-CHOME HIRATSUKA-SHI KANAGAWA 254-0014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imai, Masato Kanagawa , JP 69 1899
Miyamura, Yoshiji Kanagawa , JP 1 0

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges7814908714622651381027160483613101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +01002003004005006007008009001000110012001300140015001600

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