Method for producing semiconductor substrate and semiconductor substrate

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United States of America Patent

SERIAL NO

11658949

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Abstract

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layer prior to the SIMOX method processing is set to 0.05 (5%) or less.

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Patent Owner(s)

Patent OwnerAddress
KOMATSU DENSHI KINZOKU KABUSHIKI KAISHAHIRATSUKASHI KANAGAWA 254-0014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imai, Masato Kanagawa , JP 69 1899
Miyamura, Yoshiji Kanagawa , JP 1 0

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