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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MICROELECTRONICS TECHNOLOGY INC	NO 1 INNOVATION ROAD II HSINCHU SCIENCE-BASED INDUSTRIAL PARK HSINCHU 300

International Classification(s)

• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• 2008 Application Filing Year
• H05K Class
• 3295 Applications Filed
• 1697 Patents Issued To-Date
• 51.51 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
KO, TUNG YI	Hsinchu , TW	5	6
# of filed Patents : 5 Total Citations : 6
SUNG, HSIANG HAO	Hsinchu , TW	6	85
# of filed Patents : 6 Total Citations : 85

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Patent Citation Ranking

• 1 Citation Count
• H05K Class

• 1.90 % this patent is cited more than
• 16 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2009/0168,389

HIGH FREQUENCY COMMUNICATION APPARATUS AND WATERPROOF STRUCTURE THEREOF AND MANUFACTURING METHOD FOR WATERPROOF STRUCTURE

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Abstract

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A waterproof structure of a high frequency communication apparatus accommodates a waveguide, the waveguide comprising a waveguide channel and an extending portion connected to the waveguide channel. The waterproof structure comprises a case body and a case cover. The case cover bonds with the case body to form an inner space accommodating the waveguide and an opening through which the extending portion penetrates outwards. The case body and the case cover are bonded by glue, and the extending portion and the case body and the case cover around the opening are bonded by glue, thereby preventing moisture incursion.

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Description

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Claims

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