Encapsulated optoelectronic device
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United States of America Patent
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Issued Date -
Jul 2, 2009
app pub date -
Dec 31, 2007
filing date -
Dec 31, 2007
priority date (Note) -
Abandoned
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Abstract
The invention provides an optoelectronic device (e.g. a LED device) and method thereof. The device includes an optoelectronic component at least partially surrounded by an encapsulant comprising a silicone such as an aliphatic silicone and an adhesion promoter. The optoelectronic device exhibits improved properties such as adhesion and structural integrity, UV and thermal stability, and long term stability under accelerated aging conditions.
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