System and Method for Performing High Flow Rate Dispensation of a Chemical onto a Photolithographic Component
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United States of America Patent
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Issued Date -
Jul 2, 2009
app pub date -
Jul 19, 2007
filing date -
Jul 20, 2006
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Abandoned
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Abstract
A system and method for performing high flow rate dispensation of a chemical onto a photolithographic component are disclosed. The system and method includes providing a photolithographic component in a manufacturing tool. The photolithographic is positioned at a predetermined distance from a nozzle dispensing a chemical. Dispensation of a chemical at a high flow rate onto a photolithographic component, the rate of flow operable to reduce harmful effects from occurring on the surface of the photolithographic substrate.
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