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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MOLTEN CORPORATION	HIROSHIMA-SHI HIROSHIMA 733-0013

International Classification(s)

• A47C:CHAIRS

• 2006 Application Filing Year
• A47C Class
• 729 Applications Filed
• 383 Patents Issued To-Date
• 52.54 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hama, Syunji	Hiroshima , JP	1	1
# of filed Patents : 1 Total Citations : 1
Okazaki, Hidekazu	Hiroshima , JP	2	73
# of filed Patents : 2 Total Citations : 73
Oonishi, Hiroshi	Hiroshima , JP	2	21
# of filed Patents : 2 Total Citations : 21

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Patent Citation Ranking

• 1 Citation Count
• A47C Class

• 1.56 % this patent is cited more than
• 16 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2014/0148,019

COMPONENT MODULE, MATING CONNECTOR, AND CONNECTION STRUCTURE BETWEEN COMPONENT MODULE AND MATING CONNECTOR

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Abstract

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The invention provides a component module including a case, a circuit board, an electronic component, and a connector. The case has a through-hole. The circuit board is provided in the case. The electronic component and the connector are mounted on the circuit board. The connector includes a connecting portion and a terminal. The connecting portion is opposed to or located inside the through-hole of the case. At least a portion of the terminal is located at the connecting portion.

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Description

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Claims

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