Resin-Sealing and Molding Apparatus with Sealing Mechanism and Method of dismounting Contitiuent Part of Die Assembly Fitted Therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 25, 2009
app pub date -
Nov 1, 2006
filing date -
Nov 29, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A resin-sealed molding apparatus furnished with sealing means. The sealing means includes upper-die-side ambient air shutoff member fixed to upper-die-side mount base board so as to surround the lateral side of upper die and lower-die-side ambient air shutoff member fixed to lower-die-side mount base board so as to surround the lateral side of lower die. The upper-die-side ambient air shutoff member is fixed to the upper-die-side mount base board by means of upper-die-side fixing tool. The lower-die-side ambient air shutoff member is fixed to the lower-die-side mount base board by means of lower-die-side fixing tool. The upper-die-side ambient air shutoff member and the upper-die-side mount base board are rotatably connected by means of axis member. Only by dismounting of the lower-die-side fixing tool from the lower-die-side mount base board and the lower-die-side ambient air shutoff member, there can be realized the state in which the lower-die-side ambient air shutoff member can be completely dismounted from the lower-die-side mount base board.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully