Resin Sealing/Molding Apparatus
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United States of America Patent
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N/A
Issued Date -
Jun 25, 2009
app pub date -
Jan 26, 2007
filing date -
Mar 20, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Resin molding apparatus includes in unit, press unit and out unit. The in unit transfers not only pre-molding substrate but also resin material. The press unit includes multiple mold assemblies. The out unit transfers molded substrate having been resin-sealed within the mold assemblies. Further, the resin sealing/molding apparatus includes not only carrier rail but also demounting means and supply means traveling along the carrier rail. Furthermore, multiple press units in the state of being linked with each other are disposed between the in unit and the out unit.
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