THERMAL MANAGEMENT SYSTEMS AND METHODS
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United States of America Patent
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Issued Date -
Jun 25, 2009
app pub date -
Dec 19, 2007
filing date -
Dec 19, 2007
priority date (Note) -
Abandoned
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Abstract
Thermal management systems and methods for electronics. A printed circuit board assembly may include a soldered-in heat sink in communication with inner layers of a printed circuit board for cooling. The heat sink may include a plurality of leads received by plated through-holes in the printed circuit board. The heat sink may include features to augment surface area, as well as features to increase turbulence in a supplied cooling medium for enhanced convection. The heat sink may also include a heat pipe to facilitate cooling. The number, placement and configuration of the heat sinks may be optimized for a particular application to make efficient use of available surface area on the printed circuit board.
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