Plasma Film Deposition System
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United States of America Patent
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N/A
Issued Date -
Jun 25, 2009
app pub date -
Dec 4, 2006
filing date -
Dec 6, 2005
priority date (Note) -
Abandoned
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Abstract
A plasma film deposition system increases plasma density and improves sputtering efficiency by not generating a corner of a sheet plasma and can be operated safely by preventing occurrence of the corner in sheet plasma.The system comprises: a plasma gun capable of discharging source plasma toward a transport direction; a sheet plasma deformation chamber; a pair of magnetic field generating means provided such that same polarities thereof face each other; a film deposition chamber; and a forming magnet coil provided upstream of the pair of magnetic field generating means in the transport direction. The magnetic field generating means and the forming magnet coil generate a magnetic field whose magnetic flux densities in the transport direction are substantially constant at portions of a transport center and their vicinity portions, the portions corresponding to the forming magnet coil and the magnetic field generating means.
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