Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.

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