ROBUST DIE BONDING PROCESS FOR LED DIES
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United States of America Patent
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Issued Date -
Jun 18, 2009
app pub date -
Dec 13, 2007
filing date -
Dec 13, 2007
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Abstract
Systems and methods are provided to mitigate excess die attachment material accrual, and parasitic conductive paths formed thereby. A die attachment material (e.g., solder) is melted using a combination of localized heat sources and ultrasonic energy. The heat sources bring the die attachment material close to its melting point, which reduces an amount of bonding force associated with purely ultrasonic bonding techniques. An ultrasonic transducer brings the die attachment material the rest of the way up to its melting point, which reduces the overall temperature that the die and/or sensitive components thereon endure during the bonding process.
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