PICK AND PLACE APPARATUS INCORPORATING DEBRIS REMOVAL DEVICE
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United States of America Patent
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N/A
Issued Date -
Jun 11, 2009
app pub date -
Dec 7, 2007
filing date -
Dec 7, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A pick and place apparatus is provided for picking up an electronic component from one location and placing it at another location, which comprises a pick up tool having an opening at which electronic components are configured to be held by vacuum suction. An air channel extends through the pick up tool from the opening and is connectable for fluid communication with an air supply source which is operative to blow a quantity of air out from the opening towards the electronic component for removing any debris located thereon. The air channel is also connectable for fluid communication with a vacuum suction source which is operative to generate vacuum suction force at the opening for picking up the electronic component by vacuum suction.
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