Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method
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United States of America Patent
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app pub date -
Dec 8, 2008
filing date -
Dec 20, 2005
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Abandoned
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Abstract
A silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method are provided.More particularly, a silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method for correcting a wafer flatness in a final grinding process are provided.The silicon wafer grinding apparatus includes a grinding surface plate having a grinding pad attached thereon; a grinding head arranged opposite to the grinding surface plate and rotated in the same direction as that of the grinding surface plate; a backing film attached at a lower portion of the grinding head for supporting a wafer; and a retainer ring having an inner diameter (a wafer diameter+α) greater than a diameter of the wafer by as much as α and disposed on the backing film.By forming a diameter or physical properties of a part of the backing film of the wafer retaining assembly, the wafer flatness of the final grinding may be corrected.
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