FLUID PRESSURE DEVICE AND MANUFACTURING METHOD FOR FLUID PRESSURE DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Jun 4, 2009
app pub date -
Nov 14, 2008
filing date -
Dec 4, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A manufacturing method for a fluid pressure device and a fluid pressure device are provided, in which joints are diffusion bonded to a valve body. In the fluid pressure device, the joints are inserted into an inlet port and an outlet port formed in the valve body, and heating is performed to generate a temperature difference between the valve body and the joints, whereupon by diffusion bonding of the joints into a wall of the valve body in which the inlet port and the outlet port are formed, both members are bonded.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SMC KABUSHIKI KAISHA | 16-4 SHIMBASHI 1-CHOME MINATO-KU TOKYO 105-8659 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kawamura, Youichi | Tsukubamirai-shi , JP | 10 | 55 |
# of filed Patents : 10 Total Citations : 55 | |||
MINEGISHI, Keiichi | Saitama-shi , JP | 9 | 60 |
# of filed Patents : 9 Total Citations : 60 | |||
Wada, Kouji | Kashiwa-shi , JP | 22 | 215 |
# of filed Patents : 22 Total Citations : 215 | |||
Yoshida, Yasunori | Toride-shi , JP | 92 | 2366 |
# of filed Patents : 92 Total Citations : 2366 |
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Patent Citation Ranking
- 2 Citation Count
- F16K Class
- 5.26 % this patent is cited more than
- 16 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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