Process for Producing Partially Metallized Substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 4, 2009
app pub date -
Feb 5, 2007
filing date -
Feb 6, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Process for producing a partially metalized substrate, characterized by the following process steps: a) provision of a first substrate, b) partial printing or coating of the substrate with a surface coating which adheres only weakly to the substrate, c) application of a full-area metal layer, d) lamination to an adhesive-coated second substrate and e) detachment of this second adhesive-coated substrate, as a result of which the weakly adhering surface coating with the metallic layer on top of it is detached from the first substrate and a structured metallic layer thus remains on the first substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully