SFP Active fiber patch cord with over-molded strain relief and conductive housing
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United States of America Patent
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N/A
Issued Date -
May 21, 2009
app pub date -
Nov 19, 2008
filing date -
Nov 20, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The device includes a first optical fiber, a second optical fiber, a first transmitting optical subassembly, a second transmitting optical subassembly, a first receiving optical subassembly, a second receiving optical subassembly, a first circuit board, a second circuit board, a first amount of over-molding material, and a second amount of over-molding material.
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